Mobile phone Circuits to Get Even smaller
Transceivers, appliances such as mobile phones that can send and receive messages, have become smaller and smaller over the last few years, but users are about to experience a new meaning in miniaturisation. Research at The Hong Kong University of Science & Technology (HKUST) has successfully combined a unique system architecture and new circuit design techniques to reduce them in size like never before.Principal Investigator Dr Howard Luong said the handset of a typical mobile phone today may contain between 150 and 300 separate electrical components.
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Transceiver circuitry (left) and Dr Leung’s equivalent combining off-chip components |
His research group proposed and demonstrated circuit techniques that make it possible to combine many of these components to a single chip and therefore to significantly reduce the size of circuitry (see example in graphic). A US patent has been granted for one of the circuit techniques. The transformation applies to the CMOS (Complimentary Metal-Oxide Semiconductor) manufacturing process, which can produce integrated circuits and systems with the highest integration level at the lowest cost. Applying new techniques to the CMOS process, Dr Luong’s research enables many “off-chip”components to be combined to realize a system-on-chip. “But,” he said, “this integration created great challenges in circuit implementation.” Part of the research was to solve the problems by new circuit design techniques.“The system architecture and circuitry go hand in hand, he added. “They must both work, or neither will be useful.” The resulting design gives the highest component integration in the smallest chip area ever reported, said Dr Luong.In his design, all off-chip components are fitted into a central chip measuring 36 mm
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